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Photosensitive resin composition and the adhesive sheet 发明授权

2023-05-16 2590 518K 0

专利信息

申请日期 2025-09-18 申请号 JP2011226789
公开(公告)号 JP5974446B2 公开(公告)日 2016-08-23
公开国别 JP 申请人省市代码 全国
申请人 大日本印刷株式会社
简介 PROBLEM TO BE SOLVED : To provide a photosensitive resin composition having a sufficient storage stability and capable of enabling hardening in a short time even with a low heating temperature, and a tacky adhesive sheet.SOLUTION : The photosensitive resin composition includes a base generator for generating a base by electromagnetic wave irradiation or by heating after electromagnetic wave irradiation, a curable compound having at least two or more epoxy groups in a molecule, and a compound having a mercapto group in the molecule. The base generator is represented by formula (I) (wherein Rand Rare each independently a hydrocarbon group, which may include a hydrogen or a substituent, or an unsaturated bond, and they may be the same or different).


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