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DIELECTRIC POWDER AND MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME 发明申请

2023-08-19 3140 545K 0

专利信息

申请日期 2025-07-20 申请号 US15953942
公开(公告)号 US20190066920A1 公开(公告)日 2019-02-28
公开国别 US 申请人省市代码 全国
申请人 SAMSUNG ELECTRO MECHANICS CO LTD
简介 A multilayer ceramic electronic component includes : a body part including dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and external electrodes disposed on an outer surface of the body part and electrically connected to the internal electrodes. The dielectric layer includes grains including : a semiconductive or conductive grain core region containing a base material represented by ABO3, where A is at least one of Ba, Sr, and Ca, and B is at least one of Ti, Zr, and Hf, and a doping material including a rare earth element; and an insulating grain shell region enclosing the grain core region.


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