An epoxy compound, an epoxy compound-containing composition, and curing the sealing material

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PROBLEM TO BE SOLVED : To provide an epoxy compound excellent in heat resistance, low linear expansion property, adhesiveness or the like, an epoxy compound-containing composition, a cured product and a semiconductor encapsulating material.SOLUTION : There is provided an epoxy compound represented by the following formula (1) and having an epoxy equivalent of 140 to 620 g/eq. In above formula (1), Rto Rare each independently a group represented by the above formula (2) or a hydrogen atom, Rand Rare each independently a hydrocarbon group having 1 to 20 carbon atoms and n and m are each independently an integer of 0 to 2.