PICK-UP TRANSFER COLLET FOR SEMICONDUCTOR CHIP AND PREPARATION METHOD THEREOF

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The present invention relates to a pick-up transfer collet for a semiconductor chip and a method for manufacturing the same wherein the collet is provided with a bar containing rare earth metals, instead of the existing metal plate, and adsorption rubber, and no separate coupling process for coupling the bar containing the rare earth metals and the adsorption rubber, thereby simplifying the manufacturing process and lowering a defect rate generated from the coupling process to improve a yield rate of production. According to the present invention, the pick-up transfer collet for a semiconductor chip includes : a rectangle-shaped collet holder, from which a magnetic force is generated, having a vacuum application tube protruding from the top surface thereof, the vacuum application tube having a vacuum hole, and a rectangle-shaped coupling recess formed on the underside thereof in such a manner as to be coupled to the rectangle-shaped collect; a bar containing rare earth metals and fitted and coupled to the coupling recess of the collet holder on the top surface thereof in such a manner as to be attached to the collet holder by means of the magnetic force; and adsorption rubber located on the underside of the bar, wherein the bar and the adsorption rubber have a first adsorption hole and a second adsorption hole connected to the vacuum hole, and the second adsorption hole is formed of a plurality of fine holes.COPYRIGHT KIPO 2018