SURFACE PASSIVATION PROCESS OF COPPER ALLOY

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The invention discloses a surface passivation process of a copper alloy, comprising : mechanical grinding, electrochemical polishing, chemical degreasing, 80°C hot water washing, cold air drying, mixed acid pickling, 80°C hot water washing, cold air drying, passivation solution roller coating, distilled water washing, and cold air drying. The passivation solution comprises benzotriazole (BTA) at 3-10 g/L, citric acid at 10-20 g/L, a rare earth salt at 0.2-1 g/L, sulfosalicylic acid at 1-5 g/L, sodium dodecyl sulfate at 1-3 g/L, film formation accelerator at 1-2 g/L, and an oxidizer at 1-2 g/L. The passivation roller coating time is 3 min, and the processing temperature is 50-60°C.