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PROBLEM TO BE SOLVED : To provide a positive-type radiation-sensitive resin composition capable of forming a cured film excellent in storage stability and in addition, sufficiently satisfying general characteristics such as sensitivity, developing adhesion, heat resistance, chemical resistance, transmittance and dielectric constant while retaining good surface hardness.SOLUTION : The positive-type radiation-sensitive resin composition contains : [A] a polymer having a structural unit (I) containing at least one selected from a group represented by the formula (1) and a group represented by the formula (2) and a structural unit (II) containing an oxetane structure; and [B} an acid generator. In the formula (1), Rand Rare a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or a fluorinated alkyl group having 1 to 4 carbon atoms. In the formula (2), Rand Rare a hydrogen atom, a halogen atom, an alkyl group having 1 to 4 carbon atoms or a fluorinated alkyl group having 1 to 4 carbon atoms.SELECTED DRAWING : None