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Disclosed is a flexible copper-clad laminated film having a high grain-termination ratio and a copper-plated layer with improved bendability, and a method of producing the same. The method of producing the flexible copper clad laminate film of the present invention comprises : a step of preparing a nonconductive polymer substrate; a step of forming a tie coat layer on the nonconductive polymer substrate; a step of forming a copper seed layer on the tie coat layer through a sputtering process; and a step of forming a copper plating layer on the copper seed layer through an electrolytic plating process, wherein the plating solution used in the electrolytic plating process includes copper sulfate and a rare earth metal.COPYRIGHT KIPO 2017