The curable resin composition, curable, sealant, and semiconductor device

文件类型：PDF文档
文件大小：253K
The purpose of the present invention is to provide a curable resin composition useful for sealing semiconductor elements (particularly optical semiconductor elements), said curable resin composition having both heat resistance and corrosion resistance against corrosive gases. This curable resin composition is characterized by including a polyorganosiloxane (A), a silsesquioxane (B), an isocyanurate compound (C), and a carboxylate (E) of a rare-earth metal element, wherein a polyorganosiloxane not containing an aryl group is included as the polyorganosiloxane (A), and a ladder-type silsesquioxane is included as the silsesquioxane (B).