Curing the curable resin composition and

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PROBLEM TO BE SOLVED : To provide a thermosetting resin composition giving a cured product excellent in solvent resistance and heat resistance when polymerized and cured by heating, and to provide the cured product.SOLUTION : A thermosetting resin composition includes : (meth)acrylic polymer (A); a (meth)acrylic polymerizable monomer (B) represented by the following general formula (1); one or more polymerizable monomers (C) selected from polymerizable monomers except the (meth)acrylic polymerizable monomer (B); and a polymerization initiator (D) represented by the following general formula (2). In the formula R-O-R-OH (1) : Ris an acryloyl group or a methacryloyl group; and Ris a 1-20C linear alkylene group. In the formula R-O-(C=O)-O-O-(C=O)-O-R(2) : Rand Rare each independently a 1-40C alkyl group.