A heat-resistant adhesive

文件类型：PDF文档
文件大小：161K
PROBLEM TO BE SOLVED : To provide a heat-resistive adhesive excellent in adhesivity and heat resistance, and having an exact positional selectivity by photocuring.SOLUTION : The heat-resistive adhesive essentially contains (1) an epoxy resin, (2) a radical curing resin, (3) a photoradical initiator, and (4) a latent epoxy curing agent obtained by reacting (a) an amine compound represented by formula (I), (b) a polyamine compound having two or more amino groups in the molecule, (c) an organic polyisocyanate compound and (d) an epoxy compound. In the formula, Rand Rare each independently a 1-8C alkyl group, or mutually bond to form an alkylene group, and the alkylene group may contain an oxygen atom or a nitrogen atom; and n is an integer of 1 to 6.