PRINT WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

文件类型：PDF文档
文件大小：908K
A printed wiring board has an insulating board with a conductive metal layer formed on both surfaces of an insulating resin and a conductor layer formed on both surfaces of the insulating board and having a different circuit pattern in accordance with a region. The circuit pattern formed on the both surfaces of the insulating board includes a pattern of which line width precision is ± 10 um or less. The thickness of the conductor layer in which the area of the circuit pattern is compact and the thickness of the conductor layer in which the area of the circuit pattern is rare have the following relationship. The thickness of the conductor layer in the compact area divided by the thickness of the conductor layer in the rare area is 0.7 to 1.0.COPYRIGHT KIPO 2016