METHOD FOR RECYCLING WASTE-ABRASIVE USED IN THE LAPPING AND POLISHING OF SEMICONDUCTOR AND INDUSTRY

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The present invention relates to a method of collecting a whole quantity of waste abrasive generated from cutting and polishing processes of a semiconductor wafer and industrial wafer, including a lapping process of a sapphire wafer, and the like, and of recycling the same. The method comprises the processes of : first and second adjusting a percentage of water content of waste abrasive containing boron carbide (B_4C) which is included in expensive, rare minerals as abrasive components; first cleaning and stirring using a chemical reaction; second cleaning and stirring using Di warm water; drying; crushing; and sorting. Accordingly, recycled abrasive containing boron carbide (B_4C), which is a coarse powder, is obtained such that the boron carbide (B_4C) of waste abrasive, which is a rare mineral, is recycled with high purity. Also, the boron carbide (B_4C) is divided and sorted into a coarse powder and a fine powder, whereby each waste abrasive containing the boron carbide (B_4C) can be recycled as a raw material of abrasive with high purity and refractory.(AA) Waste abrasive (B_4C, AI_20_3, Fe_20_3, Fe, Si)(BB) Recycled abrasive B_4C(CC) Recycled refractory B_4C(S100) First adjusting a percentage of water content (30-35 wt%)(S102) Second adjusting a percentage of water content (15-20 wt%)(S104) First cleaning and stirring (chemical reaction)(S106) Second cleaning and stirring (Di cleaning)(S108) Drying(S110) Crushing(S1120) Sorting (with micro sieve or air flow distribution)COPYRIGHT KIPO 2015