BONDING WIRE

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PROBLEM TO BE SOLVED : To provide a silver bonding wire which is less expensive in comparison to a gold bonding wire, and enables a stable connection by a combination of a ball bonding method and a stud bump method. SOLUTION : A bonding wire W comprises : Ag as a primary component; 0.9-2.6 mass% of Au and 0.1-1.5 mass% of Pd which are added to the primary component, provided that the total addition amount of Au and Pd is between 1.0 and 3.0 mass% inclusive; a total of 20-500 mass ppm of at least one element selected from a group consisting of Ca and rare earth elements; and a total of 1000-10000 mass ppm of at least one element selected from a group consisting of Cu and Ni. In the wire W, the ratio of a 0.2%-yield strength and a tensile strength is 90% or larger, and the specific resistance is 3.0 μΩ cm or below. The wire W makes possible to perform a stable connection by a combination of a ball bonding method and a stud bump method. COPYRIGHT : (C)2014, JPO&INPIT