POLISHING LIQUID FOR CMP

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PROBLEM TO BE SOLVED : To provide a polishing liquid for CMP which enables the achievement of a higher polishing speed and dispersion stability while suppressing the occurrence of a polishing flaw and dishing. SOLUTION : A polishing liquid for CMP of the present invention comprises polishing material particles used for a polishing material and each having a spherical form. In the polishing material particles, the total content of at least one element selected from lanthanum, praseodymium, neodymium, samarium and europium, and cerium is 81 mol% or more to the total amount of rare earth elements contained by the polishing material particles; and the total content of at least one element selected from yttrium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium and lutetium is 19 mol% or less. COPYRIGHT : (C)2015, JPO&INPIT