半导体封闭用环氧树脂组成物及半导体装置

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Provided are a semiconductor-encapsulating epoxy resin composition that has good fluidity, a small coefficient of linear expansion, and a high glass transition temperature and exhibits low water absorptivity and excellent crack resistance. The semiconductor-encapsulating epoxy resin composition comprises (a) a naphthalene type epoxy resin represented by the following formula 1, (b) a phenolic resin hardener having at least one substituted or unsubstituted naphthalene ring in a molecule, (c) an inorganic filler, and (d) at least one compound selected from rare earth oxides or hydrotalcite compounds. In the formula 1, m and n are 0 or 1, R represents a hydrogen atom, a C1-4 alkyl group, or a phenyl group, G represents a glycidyl-containing organic group, provided that 35-85 parts by mass of the resin(wherein, m=0 and n=0) and 1-35 parts by weight of the resin(wherein, m=1 and n=1) are contained in 100 parts by mass of the resin represented by the formula 1.