Cu-Mg-P BASED COPPER ALLOY MATERIAL AND METHOD OF PRODUCING THE SAME

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Non-elastic yarn and an elastic tensile strength (purpose) scheduled balance level pushed Mg-P-cu provides manufacturing method and copper alloy. (Constitution) to mass %, mg : 0.3-2%, P : 0.001-0.1%, cu and unavoidable impurities with the balance copper alloy having composition which re-trillion , the backscatter electron diffraction as a matter of system with by EBSD by scanning type electron microscope, said copper alloy trillion re- measurement of surface measures a orientation of all the pixels transistors, 5° difference orientation between adjacent pixel in the crystal grain boundary boundary it is an above grain when considered in all the pixels in the average orientation difference between less than 4° and having a grain has an area ratio of said measuring area 45-55% and, sheet having a tensile strength of 641-708N/mm 2 is, elastic pushed 472-503N/mm 2 is.