POLISHING PAD

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The present invention provides a finishing polishing pad used in order to form a favorable mirror surface on a bare silicon wafer, glass, compound semiconductor substrate, hard disk substrate, or the like, wherein particulates, scratching of the mirror surface being polished, and other defects during polishing are rare and wherein the polishing pad is ideal for finishing in which numerous surfaces being mirror-polished are treated. This polishing pad has a compressive elastic modulus of 0.17-0.32 MPa, and is made by forming a porous polyurethane layer serving as a polishing surface layer having openings at a mean opening diameter of 10-90 μm, the main ingredient of the porous polyurethane layer being polyurethane obtained by a wet coagulation method, on a polishing pad base material formed by impregnating a nonwoven cloth composed of an extra-fine fiber bundle having a mean single fiber diameter of 30-8.0 μm with 20-50 mass% polyurethane elastomer relative to the polishing pad base material.