HIGH IMPACT TOUGHNESS SOLDER ALLOY

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A lead-free solder alloy, comprising : from 35 to 59 %wt Bi; from 0.01 to 0.5 %wt Ni; one or both of : from 0.05 to 1.0 %wt Cu, and from 0.01 to 1.0 wt% Ag; from 0 to 1.0 %wt Sb; and the balance Sn, together with any unavoidable impurities being not more than 1.0 wt.%.