ELECTROLESS PALLADIUM PLATING SOLUTION

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The present invention addresses the problem of providing an electroless palladium plating solution that yields a Pd plating film that constitutes a plated film that exhibits an excellent wire bondability even after a thermal history. The electroless palladium plating solution according to the present invention comprises a palladium compound, a reducing agent, a complexing agent, and at least one type selected from the group consisting of Ge and rare earth elements.