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Disclosed are an electrostatic chuck and a manufacturing method thereof, which are possible to reduce a leakage current due to high volume resistance to improve adsorption and desorption response characteristics of a semiconductor wafer. The electrostatic chuck, which is a sintered body in which an electrode is immersed therein to fix the semiconductor wafer by electrostatic force, includes : alumina; sintering aid; and rare-earth compound oxide containing 2 to 5 rare-earth metals different to each other, wherein adsorption and desorption response characteristics of the semiconductor wafer are within two seconds, and volume resistivity at room temperature is 1.0E + 16 to 1.0E + 17 Ω · cm.(AA) AI2_O_3 + MgO + Complex oxideCOPYRIGHT KIPO 2019