METHOD OF MANUFACTURING SILICON BONDING FILM, METHOD OF MANUFACTURING PACKAGE, PACKAGE, PIEZOELEC

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PROBLEM TO BE SOLVED : To provide : a method of manufacturing silicon bonding films, which prevents generation of rare gas when anode bonding is performed; a method of manufacturing packages; a package; a piezoelectric oscillator; an oscillator; an electronic device; and an electric wave clock. SOLUTION : A bonding film 23 for anodic bonding with a frame area 3c of a lid board 3 is manufactured on the surface 2b of a base board 2. The bonding film 23 is generated by a CVD method using an introducing gas not including rare gas. COPYRIGHT : (C)2012, JPO&INPIT