CERAMIC SINTERED COMPACT, CIRCUIT BOARD USING THE SAME, ELECTRONIC DEVICE AND THERMOELECTRIC CONVE

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Disclosed are a ceramic sintered compact with superior thermal conductivity as well as high rigidity, a circuit board that does not crack easily, a highly reliable electronic device and a highly reliable thermal electric conversion module. A ceramic sintered compact with superior thermal conductivity as well as high rigidity may be obtained by having the main component of the main crystal phase be silicon nitride and having the main components of the grain boundary phase be magnesium oxide and a rare-earth oxide as well as including a component with a composition represented by REMgSi2O5N (RE being a rare-earth metal). Furthermore, if this sintered compact is used in a circuit board, the circuit board does not crack easily and a highly reliable circuit board may be formed. An electronic device and electro-thermal conversion module that use this circuit board may be made highly reliable.