METHOD FOR GLUING COMPONENTS, FORMING A TEMPERATURE RESISTANT ADHESIVE LAYER

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The present invention relates to a method for gluing components, forming a functional adhesive layer, at least in a temperature range of ≥ 100 °C to ≤ 160 °C, wherein the adhesive layer is obtained from a curable reaction resin system. The reaction resin system comprises an epoxide resin component (A) and polymer particles (B) dispersed in the epoxide resin component (A), wherein the dispersed polymer particles further comprise addition cross-linked silicone elastomers. The invention further relates to the use of a reaction resin system for gluing piezoelectric ceramics and/or permanent magnets comprising rare earth elements and a component arrangement comprising a piezoelectric ceramic, an impedance adjustment layer and an adhesive layer that is in contact with the piezoelectric ceramic and the impedance adjustment layer.