For flat wiring, and Al alloy sputtering target

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This wiring film for a flat panel display comprises a laminate structure which is formed by laminating a first layer, which includes at least one type of high melting-point metal selected from the group consisting of Mo, Ti, Cr, W, and Ta, and a second layer, which comprises an Al alloy that includes at least 0.01 atom % but less than 0.2 atom % of at least one from among the rare earth elements, Ni, and Co. In this wiring film, even when subjected to a thermal history of high temperatures from 400-500° C., inclusive, increase in wiring resistance is suppressed, hillocks or the like do not occur, and heat resistance is excellent.