PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET AND SEMICONDUCTOR WAFER

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PURPOSE : An adhesive composition is provided to ensure a low hydrophilicity, excellent water resistance, peeling properties, re-peelability and wettability to a wafer by employing an isobornyl (meta)acrylate which is a hard-type monomer. CONSTITUTION : An adhesive composition comprises a (meth) acrylic ester monomer comprising an isobornyl (meth)acrylate; and a polymer of a monomer mixture comprising a crosslinkable monomer containing at least one functional group selected from the group consisting of -OH, carboxylic group and nitrogen-containing functional group.