MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

文件类型：PDF文档
文件大小：107K
PROBLEM TO BE SOLVED : To provide a highly reliable multilayer wiring board in which a via convex from a surface of a board is reduced and moisture entry to an internal part of the board is suppressed, and to provide a method of manufacturing the board. SOLUTION : The multilayer wiring board includes an insulating substrate where a plurality of glass ceramic insulating layers are laminated and a through conductor in which gold or silver or copper formed inside the glass ceramic insulating layers constituting at least a surface layer is a main component. The through conductor includes glass comprising 40 to 60 mass% of Si by SiO2 conversion, 5 to 15 mass% of Al by Al2O3 conversion, 10 to 20 mass% of Ca by CaO conversion, 15 to 25 mass% of Ba by BaO conversion, and 1 to 8 mass% of rare earth elements by oxide conversion. COPYRIGHT : (C)2010, JPO&INPIT