Silicon nitride substrate, method of manufacturing the same, and silicon nitride circuit board and

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A silicon nitride substrate having appropriately adjusted warpage and surface roughness can be obtained by mixing magnesium oxide of 3 to 4 wt% and at least one kind of rare-earth element oxide of 2 to 5 wt% with silicon nitride source material powder to form a sheet-molded body, sintering the sheet-molded body, and performing a heat treatment at a temperature of 1, 550 to 1, 700 degree C with a pressure of 0.5 to 6.0 kPa with a plurality of substrates being stacked. Also, a silicon nitride circuit board and a semiconductor module using the same are provided.