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Copper-based cermets and methods of preparing them are provided.
The Cu-based cermets have interpenetrating networks of copper alloy and stabilized zirconia that are in intimate contact and display high electronic connectivity through the copper alloy phase. In certain embodiments, methods of preparing the cermets involving sintering a mixture of ceramic and copper-based powders in a re-ducing atmosphere at a temperature above the melting point of the copper or copper alloy are provided. Also provided are electrochemical structures having the Cu-based cermet, e.g., as an anode structure or a barrier layer between an anode and a metal support. Applications of the cermet compositions and structures include use in high-operating-temperature electrochemical devices, including solid oxide fuel cells, hydrogen generators, electrochemical flow reactors, etc.