Method and device for cutting brittle material

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PROBLEM TO BE SOLVED : To provide a method of cutting a material only with laser scribe by causing thermal stress by the heating using laser beam irradiation or the combination of heating using laser beam irradiation and cooling using cooling liquid jetting to produce the laser scribe through sufficient thickness on the brittle material. SOLUTION : A scribe surface caused by the thermal stress is produced through the whole thickness of the material by controlling the absorption coefficient of the brittle material to the laser beam to transmit the beam extending to the whole thickness of the material or extending to the sufficient thickness even if the laser does not transmit up to the back surface. The control of the absorption coefficient is carried out by adding an optimum quantity of a rare earth atom such as Yb which absorbs an InGaAs semiconductor laser beam and generates heat, has no effect on the transmission characteristics of a visible region and does not deteriorating the display characteristics of glass for display into the material. The lower limit quantity of impurity concentration is regulated to prevent the emission of fluorescence. The semiconductor laser for irradiation is emitted from a laser stack 16 through a fiber bundle 17 arranged so that the emission end is agreed with the cutting shape. COPYRIGHT : (C)2007, JPO&INPIT