R-T-B magnet of electrolytic copper plating method

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PROBLEM TO BE SOLVED : To provide an R-T-B-base magnet having an electrolytic copper plating film which is nearly uniform in a film thickness, is free of pinholes and has excellent flawing resistance by using an electrolytic copper plating solution not containing cyanide and an electrolytic copper plates film. SOLUTION : The R-T-B-base magnet (R is at least one among rare earth elements contg. Y and T is Fe or Fe and Co) has the electrolytic copper plating film of 0.1 to 0.45 in the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) face and X-ray diffraction peak intensity I(111) from the (111) face in the X-ray diffraction by a CuKα1 ray. This electrolytic copper plating film is formed by the electrolytic copper plating method using the electrolytic copper plating solution which contains 20 to 150 g/L copper sulfate and 30 to 250 g/L chelating agent and does not contain a reducing agent of copper ions and is regulated to a pH 10.5 to 13.5.