SOLDER ALLOY

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PROBLEM TO BE SOLVED : To provide a solder composition having satisfactory bonding adhesion to a substrate to be used in optoelectronic devices such as a display, a solar cell, and a light emission device. SOLUTION : Each solder 14 is based on an alloy of Sn, Au, Ag, Cu, and one or more rare earth elements selected from Y, La, Ce, Pr, Sc, Sm, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu. Optionally, the composition may comprise In, Bi or Zn. The solder composition exhibits excellent bonding capability in such a case that different materials given in both of a flat panel display and a light emission device are bonded. Additionally, the solder provides a strong barrier to the diffusion of both water and oxygen into these devices, so as to promote the device life over a longer period of time. COPYRIGHT : (C)2008, JPO&INPIT