SOLDER ALLOY

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An alloy suitable for use in a wave solder process, reflow soldering process, hot air levelling process or a ball grid array, the alloy comprising from 0.08-3 wt.%% bismuth, from 0.15-1.5 wt.%% copper, from 0.1-1.5 wt.%% silver, from 0-0.1 wt.%% phosphorus, from 0-0.1 wt.%% germanium, from 0-0.1 wt.%% gallium, from 0-0.3 wt.%% of one or more rare earth elements, from 0-0.3 wt.%% indium, from 0-0.3 wt.%% magnesium, from 0-0.3 wt.%% calcium, from 0-0.3 wt.%% silicon, from 0-0.3 wt.%% aluminium, from 0-0.3 wt.%% zinc, and at least one of the following elements from 0.02-0.3 wt%% nickel, from 0.008-0.2 wt%% manganese, from 0.01-0.3 wt%% cobalt, from 0.01-0.3 wt%% chromium, from 0.02-0.3 wt%% iron, and from 0.008-0.1 wt%% zirconium, and the balance tin, together with unavoidable impurities. © KIPO & WIPO 2008