SPATTERING AND FILM FORMING METHOD

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A spattering device (1) has first to fourth targets (21a) to (21d). The first and second targets (21a, 21b) are disposed so that their surfaces face each other. The third and fourth targets (21c, 21d) are also disposed so that their surfaces face each other. When a dielectric film is formed, the first and second targets (21a, 21b) and the third and fourth targets (21c, 21d) are alternately spattered. When two of the targets (21a to 21d) with their surfaces facing each other are spattered, the other two of the targets (21a to 21d) function as the earth. As the result, abnormal electric discharge can be suppressed. © KIPO & WIPO 2008