A method of manufacturing a substrate for mounting the semiconductor element

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PROBLEM TO BE SOLVED : To provide a method of manufacturing a board material for semiconductor element mounting in which ceramic particles or metal particles can be dispersed uniformly so as to be capable of being worked in a thin shape or a prescribed shape, and whose production costs are low in the method of manufacturing the lightweight board material for semiconductor element mounting, whose matching property of a coefficient of thermal expansion between itself and a peripheral member is superior, and whose heat conductivity is high. SOLUTION : The method of manufacturing the board material for semiconductor element mounting is provided with a mixing process, in which particles of at least one kind selected from a group composed of the ceramic particles and the metal particles are dispersed into a molten metal so as to obtain a molten mixture; and a continuous casting process in which the molten mixture is cooled and solidified continuously so as to obtain a cast material. A rare of change of a cooling speed through a solidification process in the continuous casting process is 50% or less. COPYRIGHT : (C)2003, JPO