文件类型:PDF文档
文件大小:1074K
The disclosure is directed to methods of forming an integrated circuit structure and a related structure. One method may include : forming a gate structure over a fin, the fin being formed over a substrate and the gate structure defining a channel region beneath the gate structure within the fin; forming a notch within the fin and beneath the channel region by laterally etching the fin on opposing sides of the channel region; forming a rare-earth oxide (REO) within the notch and extending along a top surface of the fin outside of the notch; and forming a source region and a drain region on opposing sides of the channel region and over the REO that is disposed along the top surface of the fin.