BUMP MATERIAL AND BONDING STRUCTURE

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PROBLEM TO BE SOLVED : To provide a bonding structure with an Al pad electrode where the characteristic of an Ag-Au alloy is raised and bonding property is raised with an alloy bump, as a material for generating the bump with a wire or ball bump. SOLUTION : The material contains 10-60 mass% of Au with high purity not less than 99.99% and, in a residue an Ag alloy with purity not less than 99.99% as a basic matrix. Additionally, 5-100 mass ppm of Li and B, 5-100 mass ppm of Ca, 1-20 mass ppm of Be, 5-100 mass ppm of rare-earth elements Y, La, Ce, Eu and/or Nd, and further, 10-500 mass ppm, in total, of at least one kind among Ge, Mg, Sr, Bi, Zn, Si, Ga, Sn and Sb, are selectively contained as trace additive elements. Thus, ball sphericity is raised in generating the wire bump. Accordingly, a tail is suppressed, and solder thinning resistance and bonding property are raised. COPYRIGHT : (C)2007, JPO&INPIT