HIGH-STRENGTH CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

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PROBLEM TO BE SOLVED : To provide a circuit board using an Si3N4 ceramics that has a strong adhesion to a conductive layer and an insulating layer, for which warpage, burn-out, etc. are rarely occur, and manufacturing method of the circuit board, especially a high bonding strength circuit board, etc. having monolayer or multilayer interconnection through concurrent sintering. SOLUTION : The circuit board 1 includes at least the insulating layer 2 and the conductive layers 3 and 4. At least one layer of the total insulating layer has β-Si3N4 as the principal ingredient, and is a sintered object that includes one or more elements selected from a group composed of rare earth elements and alkaline earth elements. At least one layer of the total conductive layer includes one or more elements selected from those belonging to IVa, Va and VIa groups, and one or more elements selected from the groups composed of the rare earth elements and the alkaline earth elements. COPYRIGHT : (C)2007, JPO&INPIT