Method for joining workpieces using soldering alloy

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A method of joining workpieces using a solder alloy. The alloy contains either at least 1% or a maximum of about 10% by weight of an element or a mixture of elements selected from the group consisting of titanium, zirconium, hafnium, vanadium, niobium, and tantalum; either at least 0.01% or 0.01–10% by weight of an element or a mixture of elements selected from the group of the lanthanides (rare earths); either at least 0.5% or 0.5–10% by weight of an element or a mixture of elements selected from the group consisting of silver, copper, and indium; optionally either at least 0.01% or 0.01–1% by weight of gallium; and a remainder consisting of tin, lead, or of a mixture of tin and lead.