Solder material

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Solder with reduced de-alloying rate, for use with electronic components, has the following composition (wt%) : Ag and/or Cu and/or Sb 0.2 - 5; Co or at least two elements chosen from Fe, Co, Ni 0.001 - 1; an optional rare earth 0.001 - 0.5; optionally Pd or Pt 0.001 - 0.1; P 0.001 -0.01; the remainder being tin and impurities. An independent claim is included for a method for making the solder by adding the alloying components to tin or a tin alloy.