Cu-ALLOY WIRING MATERIAL AND Cu-ALLOY SPUTTERING TARGET

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PROBLEM TO BE SOLVED : To provide an electrode-wiring material which does not cause a heat defect such as a hillock and a void even when heated to a high temperature of 350°C or higher, has low electric resistance, is inexpensive, has high reliability, and is suitable for densifying an electron device, and to provide a sputtering target. SOLUTION : The wiring material having superior heat resistance and low electric resistance is obtained by using a Cu alloy which includes one or more elements selected from rare earth elements; a Cu alloy which includes one or more elements selected from the fourth group elements in the periodic table of the elements; or a Cu alloy which includes one or more elements selected from the rare earth elements and one or more elements selected from the fourth group elements in the periodic table of the elements. COPYRIGHT : (C)2006, JPO&NCIPI