MAGNETRON SPUTTERING DEVICE MAKING MAGNETIC FLUX ARRANGEMENT (BALANCED TYPE/UNBALANCED TYPE) SWITCHA

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An object exhibiting ferromagnetism at room temperature is detachably installed in the vicinity of the material target holding surface of a sputtering cathode having a balanced type magnetic flux arrangement to make a magnetic flux magnetic field arrangement at a magnetron cathode simply switchable to a balanced type or a balanced type. In addition, two magnetrons are provided so that an angle formed by the extension lines of their respective material holding surfaces is set to 160-20˚, preferably 160-70˚, and an active region is concentrated on a substrate to enable low-temperature, high-speed film forming. Further, a magnetron designed for an unbalanced type magnetic flux magnetic field is selected, and at least two mixed rare gases are used, thereby enabling lower-temperature, higher-speed film forming.