SURFACE TREATMENT APPARATUS, THIN FILM FORMING APPARATUS, SURFACE TREATMENT METHOD AND METHOD FOR

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PROBLEM TO BE SOLVED : To provide a thin film forming apparatus which eliminates influences of Cl without carrying out a post treatment process and which prevents formation of an impurity layer or the like. SOLUTION : After a Cu thin film is formed, supply of Cl2 gas 21 is stopped as well as Ar gas 22 is supplied through a gas nozzle 18 to generate Ar* so as to substitute Ar* for Cl* remaining after the film of a Cu component is formed on a substrate 3. Thereby, formation of a contaminated layer of particles due to re-reaction of residual Cl* is suppressed, the surface of the Cu layer is kept clean and the surface of a member 11 to be etched is kept clean. COPYRIGHT : (C)2006, JPO&NCIPI