MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

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PROBLEM TO BE SOLVED : To provide a manufacturing method for a semiconductor device with an insulated gate structure, by which the surface of a gate dielectic film forming region can be planarized in a small number of processes and trench corners can be rounded with sufficient controllability. SOLUTION : After the trench is formed and before the gate dielectric film is formed, an anneal treatment is made in a mixed gas atmosphere of hydrogen gas and rare gas with a hydrogen ratio at an anneal temperature T of ≤ 1.3X10-18exp(0.043T)% at the anneal temperature of 980 to 1150 °C, while a trench side wall is planarized and the trench corners are rounded so that the curvature may become no more than 0.003nm-1. On the other hand, the anneal treatment is made in a mixed gas atmosphere of hydrogen gas and rare gas with a hydrogen ratio at an anneal temperature T of ≥ 6.11X10-14exp(0.0337T) at the anneal temperature of 980 to 1040 °C, while the trench side wall is planarized and the trench corners are not rounded so that the curvature may become no less than 0.006nm-1.