ARTICLE INCLUDING SILICON SUBSTRATE, BOND LAYER AND ADDITIONAL LAYER FORMED ON BOND LAYER

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PROBLEM TO BE SOLVED : To provide an improved bond layer for an environment-resistant film. SOLUTION : This article has the bond layer and an additional layer formed on the bond layer. The bond layer includes a silicon layer containing dispersed fibers, and at least some of the fibers are extensively present between the bond layer and the additional layer. The fiber is constituted of materials selected from the group consisting of (1) alumina, (2) yttria, (3) aluminum silicate, (4) silicon carbide, (5) silicon nitride, (6) compounds of a rare earth element, an alkaline earth element, aluminum, silicon, oxygen, yttrium, nitrogen, niobium, tantalum, hafnium. zirconium and carbon, and a mixture of (1) to (6).