| 简介 |
PROBLEM TO BE SOLVED : To provide an organic compound which allows crosslinking reaction to occur at a lower temperature than before, an insulation film material comprising the organic compound, and an insulation film formed using the insulation film material.SOLUTION : A compound comprises a partial structure represented by formula (1), and a partial structure represented by formula (2) (m is an integer of 1 or more; Rand Rare an alkyl group; if the number of Ror Ris equal to or higher than two, they may be the same or different).SELECTED DRAWING : None |
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