| 申请日期 | 2025-09-16 | 申请号 | WOJP17012424 |
| 公开（公告）号 | WO2018179062A1 | 公开（公告）日 | 2018-10-04 |
| 公开国别 | WO | 申请人省市代码 | 全国 |
| 申请人 | HITACHI CHEMICAL COMPANY LTD | ||
| 简介 | Provided is a polishing liquid that comprises abrasive grains, a water-soluble compound that includes a trivalent rare-earth element, and a liquid medium, wherein the contained amount of the water-soluble compound is more than 0 mass% but less than 0.05 mass%. | ||
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