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The heat-curable resin composition, and a thermosetting sheet 发明授权

2023-03-10 2540 652K 0

专利信息

申请日期 2025-08-25 申请号 JP2015047330
公开(公告)号 JP6397784B2 公开(公告)日 2018-09-26
公开国别 JP 申请人省市代码 全国
申请人 デクセリアルズ株式会社
简介 PROBLEM TO BE SOLVED : To provide a thermosetting resin composition which can be cured at a low temperature in a short time and can be effectively cured while securing storage stability before curing.SOLUTION : The thermosetting resin composition contains a cationic curing component, an ammonium salt represented by general formula (1), and a radical generator. The radical generator is preferably an organic peroxide. [Rand Rare each independently a 1-2C alkyl; Ris H, an alkyl, an alkoxycarbonyl, or an arylcarbonyl; Y is an alkylcarbonyl, an alkoxycarbonyl, an arylcarbonyl, or the like; and Zis SbF, B(CF), C(CFSO), or the like.]SELECTED DRAWING : None


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