| 简介 |
PROBLEM TO BE SOLVED : To provide a resin composition excellent in photocurability on a substrate having a copper wiring and from which a cured film has low stress.SOLUTION : There is provided a resin composition containing following (a) component, (b) component and (c) component : (a) a polyimide precursor having a structural unit represented by the following formula (1), where Ris a tetravalent organic group, Ris a bivalent organic group, Rand Rare each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms or a monovalent organic group having a carbon-carbon unsaturated double bond; (b) a photopolymerizable compound having an ethylenically unsaturated bond; (c) a triaryl imidazole dimer, a phosphine oxide compound or an alkylphenone compound. |
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