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DIELECTRIC THIN FILM AND ELECTRONIC COMPONENT 发明申请

2023-03-29 1530 229K 0

专利信息

申请日期 2025-06-26 申请号 JP2017029422
公开(公告)号 JP2018135225A 公开(公告)日 2018-08-30
公开国别 JP 申请人省市代码 全国
申请人 MURATA MFG CO LTD
简介 PROBLEM TO BE SOLVED : To provide a dielectric thin film and an electronic component having high temperature load resistance.SOLUTION : The dielectric thin film is comprised of a compound of a perovskite-type structure represented by chemical formula : ABO3, with a site A comprising Ba, Sr and a rare earth, a site B comprising Ti, the rare earth being at least one species selected from the group consisting of La, Pr, Nd, Sm, Eu and Gd, and the content of the rare earth being more than 0.5 mol% and less than 15 mol% relative to 100 mol% of Ti.SELECTED DRAWING : Figure 1COPYRIGHT : (C)2018, JPO&INPIT


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