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The coated flexible component 发明申请

2023-04-18 2030 433K 0

专利信息

申请日期 2025-09-14 申请号 JP2018527118
公开(公告)号 JP2018538571A 公开(公告)日 2018-12-27
公开国别 JP 申请人省市代码 全国
申请人 プランゼー エスエー
简介 The invention relates to a coated flexible component (1), in particular a coated flexible electronic component, which contains a flexible substrate (2) and at least one refractory metal-based metallic coating (3). The refractory metal-based coating (3) contains more than 6 at% and less than 50 at% Re. In addition, the invention relates to a method for producing a coated flexible component (1) by providing a flexible substrate (2) and depositing at least one refractory metal-based metallic coating (3), which contains more than 6 at% and less than 50 at% Re.


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